F2-laser ablation patterning of dielectric layers |
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Authors: | D Schäfer J Ihlemann G Marowsky PR Herman |
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Institution: | Laser Laboratorium G?ttingen, Hans-Adolf-Krebs-Weg 1, 37077 G?ttingen, Germany, DE Department of Electrical and Computer Engineering, University of Toronto, Ontario, M5S 3G4, Canada, CA
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Abstract: | Spatially defined patterning of multi-layer dielectric optical systems by laser-induced ablation is demonstrated. A 49-layer
high-reflectivity mirror for 193-nm light was irradiated with F2-laser light through the CaF2-substrate to cleanly remove the whole dielectric stack by rear-sided ablation. The 157-nm light is absorbed efficiently by
dielectric layers such as SiO2 and Al2O3 that are typically used for ultraviolet (UV) transmission at 193-nm and longer wavelengths. Thus it is possible to ablate
highly reflective UV-laser mirrors (HR 193 nm) and to create dielectric masks that withstand high power levels at 193 nm.
A single 157-nm pulse with a fluence of less than 500 mJ/cm2 is sufficient to cleanly ablate the whole layer stack with sharp edges and without debris deposition.
Received: 31 October 2000 / Accepted: 14 November 2000 / Published online: 10 January 2001 |
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Keywords: | PACS: 81 65 Cf 78 20 |
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