Interfacial reactions of nickel ion containing multilayers and nickel ultra‐thin films with an interpenetrating polymer network substrate

An interpenetrating polymer network (IPN) substrate was prepared by dip‐pulling a silicon wafer or glass plate into polymer precursors, followed by solidification at room temperature. The nickel ion containing Langmuir–Blodgett (LB) multilayers was subsequently fabricated onto the IPN substrate by a LB technique, and then the nickel ultra‐thin films were deposited by chemical reduction. The interfacial reactions, the metal transformations and the non‐metal bond types during the film formation were detected by the X‐ray photoelectron spectroscopy, atomic force microscope and attenuated total reflection infrared spectroscopy. Copyright © 2011 John Wiley & Sons, Ltd.