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Transient-diffusion effects
Authors:D Stiebel  P Pichler
Institution:(1) Fraunhofer Institute of Integrated Circuits, Device Technology Department, Schottkystrasse 10, 91058 Erlangen, Germany, DE
Abstract:Transient effects on diffusion and activation during post-implantation anneals are a major obstacle for the further miniaturization of ultra-large-scale integrated semiconductor devices. The article reviews recent developments in the simulation of such phenomena with particular emphasis on models for the kinetics of self-interstitial agglomerates and boron–interstitial clusters. Received: 21 August 2002 / Accepted: 21 August 2002 / Published online: 12 February 2003 RID="*" ID="*"Corresponding author. Fax: +49-9131/761-212, E-mail: pichler@iis-bfhg.de
Keywords:PACS: 61  72  Cc  66  30  Jt  85  40  Ry
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