Combined SIMS,AES, and XPS investigations of tantalum oxide layers

Thick layers of tantalum oxide prepared by thermal and anodic oxidation have been studied by combined SIMS, AES, and XPS during depth profiling by 3keV Ar⁺ ion sputtering. The chemical composition of these films is revealed by the OKLL and O 1s signals and by the “lattice valence” parameter determined from the TaO _n ^± intensities. Thus the anodic film consists of a contamination layer, an oxygen-rich reactive interface and a thick homogeneous oxide layer followed by an interface to the Ta metal. The thermal oxide shows an oxygen concentration decreasing with depth and a broad oxide-metal interface. In both cases, carbon contamination (carbide) prevents the application of the valence model to the clean Ta substrate. The sputtering yield of the oxides was found to be 0.6 Ta₂O₅/ion.