Dynamic self-similar debonding of interface at very high velocity: Anti-plane case |
| |
Authors: | Wang Yuesheng Zhang Zimao and Wang Duo |
| |
Institution: | (1) Institute of Engineering Mechanics, Northern Jiaotong University, 100044 Beijing, China;(2) School of Astronautics, Harbin Institute of Technology, 150001 Harbin, China |
| |
Abstract: | This paper analyzes the anti-plane problem of dynamic self-similar debonding of interface at very high velocity. The debonding is modeled as an interface crack propagating self-similarly from zero-length. The extending speed is assumed to be transonic or supersonic. We first consider the dynamic debonding under moving concentrated loads. The moving dislocation model of self-similar propagation of an interface crack is used to formulate the problem to a singular integral equation which is solved analytically. The singularity of stresses near the crack tip is discussed and the dynamic stress intensity factors are presented. Finally the solution of dynamic debonding underx
2-type loads is obtained by using the superposition method. |
| |
Keywords: | interface debonding interface crack self-similar propagation transonic supersonic dynamic stress intensity factor |
本文献已被 SpringerLink 等数据库收录! |