应力降低因子和陶瓷材料抗热冲击阻力参数的性质及适用条件

将对流条件下薄板的瞬态导热问题的解析解引入自由弹性薄板的热应力场模型中，给出了相应应力降低因子的具体表达形式．为了便于比较，进一步定义了一个新的应力降低因子．详细讨论了应力降低因子及分别对应于高Biot模数和低Biot模数的第1个和第2个抗热冲击阻力参数及与中间量级的Biot模数相对应的近似表达式的性质及适用条件．将传热学与热弹性力学或断裂力学相结合的方法及有限元方法是该文所推荐的抗热震性能计算方法．研究表明，采用断裂临界温差和断裂临界无量纲时间相结合的方式能够直观简洁地表征陶瓷材料的抗热震性能．

Properties and Appropriate Conditions of Stress Reduction Factor and Thermal Shock Resistance Parameters for Ceramics

Through introducing the analytical solution of the transient heat conduction problem of the plate with convection into the thermal stress field model of the elastic plate, the stress reduction factor was presented explicitly in its dimensionless form. A new stress reduction factor was introduced for the purpose of comparison. The properties and appropriate conditions of the stress reduction factor, the first and second thermal shock resistance (TSR) parameters for the high and low Biot numbers respectively, and the approximation formulas for the intermediate Biot number interval were discussed. To investigate the TSR of ceramics more accurately, it was recommended to combine the heat transfer theory with the theory of thermoelasticity or fracture mechanics or use a numerical method. The critical rupture temperature difference and the critical rupture dimensionless time can be used to characterize the TSR of ceramics intuitively and legibly.