聚合物表面自组装电极的制备

采用在聚合物表面制备选择性化学镀电极的方法, 将具有电极结构的模板置于聚萘二甲酸乙二醇酯(PEN)基片表面上, 用紫外光进行照射, 使辐照区域表面形成羧基, 然后通过配位作用使银离子附着到表面上, 再经过紫外光照射还原出金属银颗粒, 最后以表面的金属银颗粒为催化剂进行特定区域化学镀铜形成电极. 利用四探针法测得电极的电阻率为5.063×10-2 Ω·mm2/m, 与纯金属铜的电阻率的数量级相同.

Preparation of Electrodes Technique on Polymer Substrate Surface by Self-assembly Technique

Electrode fabrication on polymer substrates surface is very important for developing many devices such as flexible thin film transistors, large area displays, electronic tags and biochemical sensors etc. In this paper, we report on direct fabrication of copper electrodes on polymer substrate surface by molecular self-assembly technique. The process involved the UV-irradiation of the polyethylene naphthalate(PEN) surface to introduce carboxyl groups and subsequent adsorption of silver ions, which were then reduced by UV-irradiation to form silver particles as the seeds to catalyze chemical deposition of copper. Using a photomask, the copper electrodes could be successfully fabricated on the selected surface sites. So the obtained copper electrodes possess an electric resistivity of 5.063×10-2 Ω·mm2/m, which is on the same order of magnitude as pure metal copper. This method is simple and convenient, which provides a very good way for fabricating electrodes on polymer substrate.