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Preparation of copper foam with 3-dimensionally interconnected spherical pore network by electrodeposition |
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| Authors: | Jeong-Han Kim Ryoung-Hee Kim Hyuk-Sang Kwon |
| Affiliation: | aDepartment of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-dong, YuSeong-gu, Daejeon 305-701, Republic of Korea |
| Abstract: | |
| Keywords: | Copper foam Electrodeposition Foam structure Chemical additives Hydrogen evolution Porosity |
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