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Effect of modification of S-terminated Ge(1 0 0) surface on ALD HfO2 gate stack
Authors:Younghwan Lee  Kyung Taek Im  Seongil Im  Yeonjin Yi
Institution:a Department of Chemical and Biomolecular Engineering, Yonsei University, 134 Shinchon-dong, Seodaemoon-gu, Seoul 120-749, Republic of Korea
b Department of Physics, Yonsei University, 134 Shinchon-dong, Seodaemoon-gu, Seoul 120-749, Republic of Korea
c Department of Nano Surface Science, University of Science and Technology, 52 Eoeun-dong, Yuseong-gu, Daejeon 305-333, Republic of Korea
d Division of Advanced Technology, Korea Research Institute of Standards and Science, 209 Gajeong-Ro, Yuseong-gu, Daejeon 305-340, Republic of Korea
Abstract:When S-termination on a Ge(1 0 0) surface was desorbed at an elevated temperature and an atomic layer deposition (ALD) HfO2 film was deposited, interfacial thickness was less than 1 nm. As a result, the equivalent oxide thickness (EOT) of the stack on the initially S-terminated surface was thinner than that deposited on the O3-oxidized surface, while HfO2 film thickness was almost identical on both surfaces. Nevertheless, the HfO2 stack on the initially S-terminated surface exhibited improved leakage current characteristics due to an increase in barrier height. Its thinner but robust interface will contribute to the scaling down of gate oxide integrity.
Keywords:61  72  uf  82  80  Gk
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