Dependence of the Rate of Electrodeposition of Metals at Mono- and Multielectrodes on Voltage in the Case of an Exaltation Mechanism of Mass Transport

Dependences of the rate of copper deposition on mono- and multielectrodes out of dilute solutions of acetic acid at voltages of 20–250 V are compared. It is established that the same rate of deposition in the case of a multielectrode (25 electrodes with a diameter of 0.1 mm) takes place at a voltage that is lower by 2.7 times than that in the case of a monoelectrode with a diameter of 0.5 mm and the same area. The same results are obtained during electrodeposition of cadmium and thallium. In order to explain this effect, a two-layered model of potential distribution is suggested. In accordance with this model, the resistance of electrolyte in the vicinity of a multielectrode is equal to the sum of the resistance of the layer nearest to the electrode (where it is determined by the sum of conductances to each microelectrode) and the external layer, where the potential distribution is close to hemispherical. It is shown that calculations in accordance with this model allow one to give an estimate of the effect's scale that agrees with experiment and to predict its possible limits following an increase in the number of electrodes that make up a multielectrode.