A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects |
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| Institution: | 1. Department of Engineering Design, Indian Institute of Technology, Madras, Chennai 600036, India;2. Faculty of Engineering and the Environment, University of Southampton, Highfield, Southampton, SO17 1BJ, UK;1. Key Laboratory of Ministry of Education for Geomechanics and Embankment Engineering, Hohai University, Nanjing 210098, China;2. Institute of Geotechnical Engineering, Hohai University, Nanjing, Jiangsu 210098, China;3. Laboratory of Multiscale and Multiphysics Mechanics, University of Lille, CNRS FRE 2016, LaMcube, Lille 59000, France;1. Advanced Sustainable Manufacturing Technologies (ASTUTE), College of Engineering, Swansea University, Singleton Park, Swansea SA2 8PP, United Kingdom;2. Electronic Motion Systems UK Ltd., Heol-y-Ddraig, Penllergaer Business Park, Penllergaer, Swansea SA4 9HL, United Kingdom;1. Faculty of Engineering Technology, Hasselt University, Hasselt, Belgium;2. Department of Industrial Engineering, University of Padova, Padua, Italy;3. Faculty of Civil Engineering and Geosciences, Delft University of Technology, Delft, The Netherlands |
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| Abstract: | Below certain length scales and in the presence of a non-uniform plastic strain field the mechanical behavior of many metals and its alloys is substantially different from that in bulk specimens. In particular, an increase in resistance with decreasing size has been observed in Pb/Sn eutectic solder alloys which are extensively used in microelectronics packaging interconnects. Due to the high homologous temperature, the Pb/Sn solder exhibits creep–fatigue interaction and significant time, temperature, stress and rate dependent material characteristics. The simultaneous consideration of all the above mentioned factors makes constitutive modeling an extremely difficult task. In this paper, a viscoplastic constitutive model unified with a thermodynamics based damage evolution model is embedded into a couple stress framework in order to simulate low cycle fatigue response coupled to size effects. The model is implemented into commercial finite element code ABAQUS. The microbending experiment on thin nickel foils is used to validate the model. Analyses are performed on a thin layer solder joint in bending under cyclic loading conditions. |
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