Formation of a tetragonal Cu3Au alloy at gold/copper interfaces

A gold–copper alloy with a nominal composition of Cu₃Au but with a tetragonal (c = 4a) structure is observed to form at Au/Cu interfaces of gold/copper multilayers deposited on amorphous substrates by d.c. magnetron sputtering. The formation of this non‐equilibrium structure (tentatively D0₂₃) under‐ambient conditions is detected by secondary ion mass spectrometry, x‐ray diffraction and high‐resolution cross‐sectional transmission electron microscopy. Co‐sputtering of Au and Cu under similar conditions produces only conventional fcc Cu₃Au alloy phases, suggesting that interfacial confinement plays a significant role in producing the novel Cu₃Au alloy phase in gold/copper multilayers. Copyright © 2003 John Wiley & Sons, Ltd.