表面修饰改善溶液法金属诱导晶化薄膜稳定性与均匀性研究

提出了一种表面修饰的金属诱导晶化方法，以稳定地获得晶粒尺寸均匀的多晶硅薄膜.为在非晶硅表面获得均匀稳定的Ni源，在晶化前驱物表面浸沾Ni盐溶液之前，先旋涂一层表面亲合剂.通过控制Ni盐溶液的浓度，可以获得均匀性较好、晶粒尺寸分布在20—70μm的多晶硅薄膜.该方法的特点是改善了Ni盐溶液在表面的黏附状态，从而可在比常规Ni盐溶液浓度低1—2个数量级的情况下仍能获得大晶粒的多晶薄膜. 关键词： 表面修饰 溶液法金属诱导晶化 多晶硅 均匀性

Investigation on the improvement of the stability and uniformity of solution-based metal-induced crystallization poly-Si using surface-embellishment

To obtain poly-Si with good uniformity and stability, a new method of solution-based metal-induced crystallization (S-MIC) with surface-embellishment wasproposed in this paper. A special solution that can embellish the surface of a-Si was employed to improve the conglutination between nickel and a-Si thin film. Before the nickel solution was spin coated, the special solution was spin coated on the a-Si sample at first. By controlling the nickel salt concentration, the poly-Si with grain size of 20—70 μm and good uniformity could be achieved. Furthermore, the nickel salt concentration is lower than that used in the traditional method of S-MIC by 1 or 2 orders of magnitude.