| 电子封装微焊点中的柯肯达尔孔洞问题 |
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| 引用本文： | 邹建,吴丰顺,王波,刘辉,周龙早,吴懿平. 电子封装微焊点中的柯肯达尔孔洞问题[J]. 电子工艺技术, 2010, 31(1): 1-5 |
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| 作者姓名： | 邹建 吴丰顺 王波 刘辉 周龙早 吴懿平 |
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| 作者单位： | 华中科技大学材料成形及模具国家重点实验室,湖北,武汉,430074 |
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| 基金项目： | 现代焊接生产技术国家重点实验室面上开放基金(项目编号:焊接09013);;国家自然科学基金(项目编号:60776033) |
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| 摘 要： | 简述目前在微焊点内部产生的六种孔洞缺陷。微焊点中的孔洞会导致焊点强度快速下降，一直危害着电子产品的可靠性，软钎料／Cu基盘界面在高温时效老化后会出现了大量的柯肯达尔孔洞，柯肯达尔孔洞的存在将会对应用于高温环境和高应力的封装焊点可靠性产生不好的影响。结合目前的研究状况分析了时效老化时Kirkendall（柯肯达尔）孔洞的形成机理和Kirkendall孔洞对焊点可靠性的影响，重点研究了焊盘材料、材质、焊料掺杂元素和UBM预处理等因素影响柯肯达尔孔洞形成的机理。
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| 关 键 词： | 微焊点 柯肯达尔孔洞 可靠性 老化 |
Kirkendall Voids in Micron Solder Joint Used in Electronic Packaging |
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| ZOU Jian,WU Feng-shun,WANG Bo,LIU Hui,ZHOU Long-zao,WU Yi-ping. Kirkendall Voids in Micron Solder Joint Used in Electronic Packaging[J]. Electronics Process Technology, 2010, 31(1): 1-5 |
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| Authors: | ZOU Jian WU Feng-shun WANG Bo LIU Hui ZHOU Long-zao WU Yi-ping |
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| Affiliation: | Huazhong University of Science & Technology;State Key Laboratory of MaterialProcessing and Die & Mould Technology;Wuhan 430074;China |
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| Abstract: | Describe six void-defects formed in micro solder joints.Voids have always been a reliability problem in electronics because they lead to rapid decline in strength of micro solder joints.Extensive Kirkendall voids formed at the interface of solder joint to Cu substrate under high temperature aging,and they have bad effects on the reliability of package solder joints applied in high temperature and high stress environment.It presents the mechanism of kirkendall void formation under high temperature aging and ... |
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| Keywords: | Micro solder joint Kirkendall voids Reliability Aging |
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