Interface characterization of nickel contacts to bulk bismuth tellurium selenide |
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| Authors: | O D Iyore T H Lee R P Gupta J B White H N Alshareef M J Kim BE Gnade |
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| Institution: | 1. Department of Materials Science and Engineering, University of Texas at Dallas, Richardson TX 75080, USA;2. Marlow Industries, Dallas, TX 75238, USA |
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| Abstract: | Transmission electron microscopy (TEM) characterization of nickel contacts to bulk bismuth tellurium selenide Bi2(Te,Se)3] is reported. Samples were prepared in a dual column focused ion beam/scanning electron microscope (FIB/SEM) system using a lift‐out technique, with ion beam energy and exposure times carefully optimized to minimize sample damage. Diffusion of Ni into Bi2(Te,Se)3 was observed and the formation of a nickel telluride (NiTe) interfacial region confirmed after heat treatment at 200 °C. Selected area diffraction patterns provided evidence of a modified bismuth telluride–like structure at the interface, identified by analytical electron microscopy to be composed of Ni and Bi2(Te,Se)3. Copyright © 2009 John Wiley & Sons, Ltd. |
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| Keywords: | electron energy loss spectroscopy focused ion beam transmission electron microscopy thermoelectric materials x‐ray diffraction |
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