| 微波集成电路的接口技术与接地技术 |
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| 引用本文： | 刘世刚.微波集成电路的接口技术与接地技术[J].电讯技术,1992,32(1):52-57. |
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| 作者姓名： | 刘世刚 |
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| 作者单位： | 机电部第十研究所 工程师 |
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| 摘 要： | 本文介绍了微波集成电路接口技术中常用的几种接口技术,及其结构设计方法。对微波集成电路中微带片的接地,屏蔽隔板接地设计也作了一些介绍。应用这些方法,将使电磁兼容效果更加满意。
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| 关 键 词： | 电磁兼容 微波集成电路 接口 接地 |
Interface and Ground of Microwave IC |
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| Engineer Liu Shigang The Tenth Institute of Ministry of Machine-Building and Electronics Industry.Interface and Ground of Microwave IC[J].Telecommunication Engineering,1992,32(1):52-57. |
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| Authors: | Engineer Liu Shigang The Tenth Institute of Ministry of Machine-Building and Electronics Industry |
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| Institution: | Engineer Liu Shigang The Tenth Institute of Ministry of Machine-Building and Electronics Industry |
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| Abstract: | This paper introduces several usual interface techniques of microwave
integtated circuit and methods of the structure design. Ground of Microstrip slice in
microwave integrated circuit and grounded design of the shield isolation board are
also introduced in the paper. Those methods are more satisfactory for electromag-
netic compatibility. |
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| Keywords: | Electronic Machinary Electromagnetic Compatibility |
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