Micro thermal shear stress sensor based on vacuum anodic bonding and bulk-micromachining |
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Authors: | Yi Liang Ou Yi Shi Sha-Li Ma Jin Chen Da-Peng and Ye Tian-Chun |
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Institution: | School of Physics &
Microelectronics, Shandong University, Jinan
250100, China; Silicon Device & Integrated Technology
Department, Institute of Microelectronics of Chinese Academy of
Sciences,
Beijing 100029, China; Silicon Device & Integrated Technology
Department, Institute of Microelectronics of Chinese Academy of
Sciences,
Beijing 100029, China;School of Physics &
Microelectronics, Shandong University, Jinan
250100, China |
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Abstract: | This paper describes a micro thermal shear stress sensor with a
cavity underneath, based on vacuum anodic bonding and bulk
micromachined technology. A Ti/Pt alloy strip, 2$\mu $m$\times
$100$\mu $m, is deposited on the top of a thin silicon nitride
diaphragm and functioned as the thermal sensor element. By using
vacuum anodic bonding and bulk-si anisotropic wet etching process
instead of the sacrificial-layer technique, a cavity, functioned as
the adiabatic vacuum chamber, 200$\mu $m$\times $200$\mu $m$^{
}\times $400$\mu $m, is placed between the silicon nitride diaphragm
and glass (Corning 7740). This method totally avoid adhesion problem
which is a major issue of the sacrificial-layer technique. |
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Keywords: | thermal micro shear stress
sensor vacuum anodic bonding bulk-micromachined |
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