高耐热、低介电常数含氟聚酰亚胺材料的合成与性能研究

合成了一系列新型含氟耐高温、低介电常数聚酰亚胺 (PI)材料 ,并对其进行了热性能、电性能等方面的测试 .结果表明 ,这类分子结构中含吡啶环单元的材料可保持PI固有的耐热性能 ,其在氮气下的热分解温度为 5 4 5～ 6 0 1℃ ;而侧链的双三氟甲基取代结构一方面使分子具有较高的氟含量 ,另一方面增大了分子的自由体积 ,这两方面的共同作用使得这类材料具有优良的介电性能 ,其介电常数为 2 86～ 2 91;击穿电压为15 0 4～ 197 3kV mm .

SYNTHESIS AND CHARACTERIZATION OF FLUORINATED POLYIMIDES WITH HIGH HEAT RESISTANCE AND LOW DIELECTRIC CONSTANT

New fluorinated polyimides with high heat resistance and low dielectric constants have been synthesized by a two step procedure.The thermal,mechanical and electrical properties were measured,which indicated that the polyimides with pyridine moieties in the main chain showed both good heat resistance and mechanical properties with initial thermal decomposition temperatures of 545～601℃ in nitrogen and elongation at break of 9%～16% and tensile strength of 94 2～147 3 MPa.The polyimide films showed also good dielectric properties with dielectric constants of 2 86～2 91 at 1 MHz frequency and breakdown voltage of 150 4～197 3?kV/mm,which was mainly because of the high fluoro content and large free volume in the molecular structures.All the properties made them great potential candidates for advanced packaging in microelectronic applications.