Chemical thermodynamics |
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| Authors: | Dr. László Beda |
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| Affiliation: | (1) YbI Miklós Polytechnic, Budapest, Hungary |
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| Abstract: | The curing of composition containing epoxy bond is complicated chemical and technological process where under temperature and pressure conditions a change of its structure occurs. The structure changes are possible to know by thermal methods as DSC, DTA, etc. and also by measurement of dielectrical response under the low frequency electrical field. |
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| Keywords: | composition curing level enthalpy epoxi bond |
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