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Hands on: thermal bonding of nano- and microfluidic chips |
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| Authors: | Renberg Björn Sato Kae Tsukahara Takehiko Mawatari Kazuma Kitamori Takehiko |
| Institution: | 1.Department of Applied Chemistry, School of Engineering, The University of Tokyo, 7-3-1, Hongo, Bunkyo, Tokyo, 113-8656, Japan ;2.Research Laboratory for Nuclear Reactors, Tokyo Institute of Technology, 2-12-1-N1-32 O-Okayama, Meguro-ku, Tokyo, 152-8550, Japan ;3.KAST Group, Kanagawa Academy of Science and Technology (KAST), Ksp Bldg. East 307, 3-2-1 Sakado, Takahatsu-ku, Kawasaki-shi, Kanagawa, 213-0012, Japan ; |
| Abstract: | Microchimica Acta - Fused silica microchips have several attractive features; they are stable, transparent and allow fabrication with immense precision, also of nanochannels, which make them good... |
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