p型Si上Ni—Pd薄膜的电化学制备及其表征

采用控电位沉积方式在ｐ型Ｓｉ上制备了Ｎｉ－Ｐｄ合金薄膜；考察了合金的阴极沉积和阳极溶出行为；研究了极化方式对膜组成、厚度、结构及形貌的影响．结果表明，在沉积初期，膜主要以层状方式生长，当膜增厚或阴极极化增强时，则以岛状形式生长．Ｘ射线衍射测试表明，Ｎｉ－Ｐｄ合金呈面心立方结构，其晶面间距随合金组成不同而变化．

Electrochemical Preparation of Ni Pd Film on p type Silicon and Its Characterization

Nickel palladium alloy film was prepared on p type silicon using potential controlled electrodeposition. Cathodic deposition and anodic stripping behavior were investigated as well. The influence of polarization style on the composition, thickness, morphology and structure of film was studied by means of energy dispersive X ray analysis, X ray diffraction (XRD) and scanning electron microscope(SEM). SEM showed that at the initial stage nickel palladium forms a layered structure, with the film growing and the polarization enhanced, an island growth was found. XRD indicated that nickel palladium alloy has a face centered cubic structure and the distance between crystal planes changes with the composition of deposit.