端环氧基聚硅氧烷对环氧模塑料的改性

引入端环氧基聚硅氧烷对环氧封装材料的低应力化作用，将聚硅氧烷直接与环氧树脂及固化剂共混，由于聚硅氧烷不能完全键事到脂基体上，模塑料出现表面渗油，将端环氧基聚二甲基硅氧烷首先与不环氧树脂首先与环氧树脂的固化剂－酚醛树脂预反应形成嵌段共聚物，然后再与环氧树脂混合，解决了渗油，使聚硅氧烷在环氧树脂中的分布更均匀，相区尺寸更小，在环氧树脂固化物中，聚硅氧烷微区尺寸依赖于预反应条件、聚硅氧烷嵌段链长和聚硅氧

Modification of Epoxy Molding Compounds with Epoxy-terminated Polydimethylsiloxane

This paper concerns with lowering the internal stress of epoxy molding com-pounds by incorporation of epoxy-terminated polydimethylsiloxanes. When the modifier wasblended with epoxy resin and novolac resin curing agent directly,surface bleeding of thepolysiloxane occurred.When the polysiloxane was first prereacted with the novolac resin toform a block copolymer and then blended with the epoxy resin,the polysiloxane bleedingwas prevented,the polysiloxane phase was smaller in size and the domain distribution in theresin matrix was more even.The main factors influencing the internal stress were investigat-ed. It was found that the domain size of the polysiloxane phase depended on the syntheticconditions of the copolymers,the length of polysiloxane chain and the content of polysilox-ane in the cured resin.The flexural modulus of the epoxy molding compounds dependedmainly on the interface area between the polysiloxane phase and the resin matrix, while thethermal expansion coefficient below Tg was dependent not only on the interface area betweenthe two phases,but also on the interaction between the resin/filler matrix and polysiloxanephase to a great extent.