Stress analysis of thin polyimide films using holographic interferometry

It is proposed that the residual stresses due to curing in a spin-coated polyimide film can be determined using the solution to the problem of a vibrating membrane. The membrane is biaxially constrained and supported on a metal washer or copper substrate. A piezoelectric transducer is used to excite the sample. The membrane vibrates uniformly in response to its resonant frequencies. The vibration pattern is recorded using time-average holographic interferometry. The pattern produced is indicative of the mode of vibration. The biaxial stress in the film can be calculated from measuring the characteristic frequency, the density of the material, and the mode of vibration. The effect of mass loading of air on the apparent stress in these membranes is also investigated. Measurements made in vacuum appear to resolve this problem. The stresses calculated are on the order of 10 MPa.