The effects of oxygen,hydrogen and fluorine on the conductivity of high purity evaporated amorphous silicon films

Electron bombardment evaporation was used to deposit amorphous silicon (α-Si) films in an evaporator with a base pressure of 2 × 10^?10 Torr. Rutherford backscattering analysis was used to establish the conditions necessary for deposition of pure films.The DC conductivity was measured as a function of temperature (? 150°C to + 140°C). Pure films, which were deposited between room temperature and 400°C, were found to have a room temperature conductivity (σ_RT) in the region of 10^?3μ^?1cm^?1 and a log $\text{σα}\text{T}{}^{\mathrm{<mtext>1</mtext><mtext>4</mtext>}}$ dependence. The value of σ_RT could be reduced by annealing reaching a minimum of 2 × 10^?7μ^?1 cm^?1 for an anneal temperature (T_A) of 520°C, but activated conduction was not observed.The implantation of hydrogen or fluorine (or contamination with oxygen) had the effect of reducing σ_RT, with a minimum value of less than 10^?8μ^?1cm^?1 (T_A = 400°C) for fluorine implantation to a dose of ≈ 10¹⁶ cm² (≈ 0.4 at% concentration). These films had high temperature (50°C) activation energies typical of activated conduction in extended states on the edge of the mobility gap. Implantation of fluorine to a dose of 1.5 × 10¹⁷ resulted in a rise of σ_RT (T_A = 400°C) to nearly 10⁴μ^?1 cm^?1 and log $\text{σα}\text{T}{}^{\mathrm{<mtext>?1</mtext><mtext>4</mtext>}}$ behaviour.X-ray analysis revealed that some crystallization occurred in films annealed at 600°C. This is correlated with a rise in σ_RT of the pure films and the disappearance of the effects of the introduced impurities.