In-Situ Intrinsic Interface Strength Measurement at Elevated Temperatures and its Relationship to Interfacial Structure |
| |
Authors: | V. Gupta V. Kireev S.N. Basu H. Wu |
| |
Affiliation: | (1) Department of Mechanical and Aerospace Engineering, UCLA, Los Angeles, CA 90095, USA;(2) Department of Manufacturing Engineering, Boston University, Boston, MA 02215, USA;(3) Texas Instruments Inc. (Formerly of Boston University), Attleboro, MA 02703, USA |
| |
Abstract: | A previously developed laser spallation technique has been modified to measure the tensile strength of thin film interfaces in-situ at temperatures up to 1100°C. Tensile strengths of Nb/A-plane sapphire, FeCrAl/A-plane sapphire and FeCrAlY/A-plane sapphire were measured up to 950°C. The measured strengths at high temperatures were substantially lower compared with their corresponding strengths at ambient temperature. For example, at 850°C, the interface tensile strength for the Nb/sapphire (151 ± 17 MPa), FeCrAl/sapphire (62 ± 8 MPa) and FeCrAlY/sapphire (82 ± 11 MPa) interface systems were lower by factors of approximately, 3, 5, and 8, respectively, over their corresponding ambient values. These results underscore the importance of using such in-situ measured values under operating conditions as the failure criterion in any life prediction or reliability models of such coated systems where local interface temperature excursions are expected. The results on alloy film interfaces also demonstrate that the presence of Y increases the strength of FeCrAl/Al2O3 interfaces. |
| |
Keywords: | interfacial fracture mechanics crack driving force interface crack kinking |
本文献已被 SpringerLink 等数据库收录! |
|