Cu(Ⅱ)对壳聚糖的配位控制降解

对壳聚糖进行液态均相络合反应制得壳聚糖铜配合物,IR、UV、元素分析及热重分析等检测证实了壳聚糖铜配合物中配位键的存在,且显示壳聚糖在形成配位结构后存在有利于降解的优势构象。以H₂O₂对壳聚糖-Cu(Ⅱ)络合物及壳聚糖进行氧化降解,考察降解过程中粘度的变化及降解产物分子量分布,在相同的降解条件下,壳聚糖铜配合物的降解速度明显高于壳聚糖,降解产物分子量分布较壳聚糖直接降解窄,结果进一步证明壳聚糖铜配合物中存在有利于降解的优势结构,同时证明以金属离子Cu(Ⅱ)对壳聚

Formation of Chitosan Cu (Ⅱ) Complex and Control Degradation

Complex of chitosan and Cu? was prepared by liquid homogenous coordination. IR, UV, elemental analysis, thermal weight analysis were conducted for the complex. The results of those analysis showed that there was coordinating band between chitosan and Cu?, and some structure which was easy to break existed in the complex. H2O2 was used to degrade chitosan Cu? complex and chitosan, and viscosity difference and molecular distribution of degraded products were investigated. In the same conditions, degradation velocity of chitosan Cu? complex was exactly faster than that of chitosan, and the molecular distribution of the former was much more narrow than that of the latter. The results of degradation farther confirmed there was some structure which was easy to break existed in the complex, and coordinating controlled degradation for chitosan with Cu? was viable.