论电子产品SMT制造工艺的缺陷研究

主要讨论了焊接缺陷在电子产品SMT制造工艺中的成因,以整个SMT制造工艺为研究范畴,通过几个设定的仿真实验,从模板制作、焊膏选择、印刷工序、焊接工序、贴片工序等角度,以一个常见缺陷桥连为研究对象,分析造成桥连的缺陷成因,研究解决的办法,评价各成因因子的危害程度,并以此为基础拓展到其他缺陷,得出SMT生产工艺改进的要点。

Analyzing the defect of SMT manufacturing process for electronic product

The paper mainly discusses the causes of welding defects in electronic products SMT manu- facturing process,the scope of the study to all SMT manufacturing process,Through several scheduled emulational experimentation,analyse the causes of the defects caused bridged and Research solutions for the study to a common defects——bridged from the stencil production、solder paster selecting, printing processes,welding processes、pick and place processes and so on,estimate the degree of haz- ard of all defect causes,outspread to other deficiencies on this basis,obtain the points to improve SMT production process。