本土IC封测业面临的挑战

2006年中国大陆封测业销售额496．6亿元，比2005年增长了44％，占2006年中国IC产业销售额的50．8％，未达到国际公认的设计业：制造业：封测业=30％：40％：30％的要求。目前大陆IC封装以中低端DIP、SOP（SSOP、TSOP）、QFP（LQFP、TQFP）为主，正在向高附加值、多引脚数QFP、MCM（MCP）、BGA、CSP、SiP、PiP、PoP等中高端封装过渡。近年来，本土封装在技术上的某些领域有所突破，如江阴长电FBP、南通富士通MCM（MCP）、BGA、中电科技第13所CBGA等，但是仍面临着全球IC大厂、IC封测厂、产能、技术和人才等多方面的挑战，只有正视这些挑战，采取积极措施，克服弊端，才能进步。文章最后得出结论，未来5年，中国IC封测业有可能成为全球最大的半导体封测基地。

Challenges for Packaging-testing Industry in China

The Packaging-testing industry sale reaches 496.6 hundred million yuan in 2006,which increase 44% than what was in 2005. It makes up 50.8% of Chinese IC industry sales. But it does not achieve the requirement of the international standards for designing industry∶manufacturing industry∶packaging-testing industry=30%∶40%∶30%.The low and middle ends DIP,SOP(SSOP,TSOP) and QFP(LQFP,TQFP) are the leading products of Chinese IC packaging at the moment. And now,the products are transiting to the middle and high ends,such as QFP,MCM(MCP) ,BGA,CSP,SiP,PiP and PoP. Some important break-throughs have been made including Jiang yin Chang dian FBP,Nantong Fujitsu MCM(MCP) ,BGA and The CETC 13th Research Institute's CBGA. But many challenge lies ahead of Chinese IC Packaging-testing industry. However,the packaging-testing industry in China is now facing the challenges from the large factories worldwide,which have advantages of productivity,technology and qualified personnel etc. So effective mea-sures must be taken. The native packaging-testing industry have the great possibilities to becoming the largest packaging and test base in the world.