Study of Low-Temperature Thermocompression Bonding
in Ag-In Solder for Packaging Applications |
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Authors: | Riko I Made Chee Lip Gan Li Ling Yan Aibin Yu Seung Wook Yoon John H Lau Chengkuo Lee |
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Institution: | (1) School of Mechanical and Electrical Engineering, Central South University, Lushan South Road, Changsha, Hunan Province, 410083, P.R. China |
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Abstract: | Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this
article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists
of AgIn2 and Ag9In4 phases, with the latter phase having a melting temperature higher than 400°C. Complete consumption of In solder into a Ag-rich
intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180°C for 40 min. We also observe that the bonding
pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa.
Finally, prolonged aging leads to the formation of the final phase of Ag9In4 in the bonded joints. |
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Keywords: | Low-temperature solder indium IC MEMS packaging |
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