| 硝酸法控制FPC基材渗镀化学镍金的研究 |
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| 引用本文： | 袁鹏飞,陈苑明,何为,彭勇强,刘惠民. 硝酸法控制FPC基材渗镀化学镍金的研究[J]. 印制电路信息, 2013, 0(5): 42-45 |
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| 作者姓名： | 袁鹏飞 陈苑明 何为 彭勇强 刘惠民 |
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| 作者单位： | [1]电子科技大学应用化学系,四川成都610054 [2]奈电软性科技电子（珠海）有限公司技术中心,广东珠海519040 |
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| 摘 要： | 化学镍金工艺会产生基材渗镀的问题。讨论了FPC基材渗镀化学镍金的形成机理,采用硝酸法研究了基材渗镀化学镍金的控制要点,应用正交实验优化了硝酸处理FPC基材渗镀化学镍金的工艺参数。结果表明硝酸法可有效控制基材吸附镍金层,获得了最佳硝酸处理的工艺参数:活化时间90 s,温度30℃,硝酸浓度3 mol/L,反应时间30 s。
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| 关 键 词： | 化学镍金 渗镀 硝酸法 优化实验 |
Prevention of ENIG depositing in FPC base materials with nitric acid |
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| YUAN Pengofei,CHEN Yuan-ming,HE Wei,PENG Yong-qiang,LIU Hui-min. Prevention of ENIG depositing in FPC base materials with nitric acid[J]. Printed Circuit Information, 2013, 0(5): 42-45 |
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| Authors: | YUAN Pengofei CHEN Yuan-ming HE Wei PENG Yong-qiang LIU Hui-min |
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| Affiliation: | YUAN Pengofei CHEN Yuan-ming HE Wei PENG Yong-qiang LIU Hui-min |
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| Abstract: | ENIG （Electroless Nickel/Immersion Gold） layer can be deposited in base materials during manufacturing processes. The mechanism was discussed on depositing ENIG in FPC base materials. Nitric acid was applied for preventing base materials adsorbing with ENIG layer. Parameters of nitric acid process were optimized with orthogonal experiments. The results shown base materials adsorbing with ENIG layer could be effectively prevented via nitric acid method and best parameters of nitric acid process were obtained as activation time of 90 seconds, temperature of 30℃, nitric acid concentration of 3 mol/L, reaction time of 30 seconds. |
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| Keywords: | ENIG Deposit Nitric Acid Process Orthogonal Experiments |
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