| 硅基片材料激光热处理的实验研究 |
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| 引用本文： | 程国义,程念贫,阚成侠,胡宗福.硅基片材料激光热处理的实验研究[J].中国激光,1994,21(8):688-692. |
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| 作者姓名： | 程国义 程念贫 阚成侠 胡宗福 |
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| 作者单位： | 合肥工业大学管理工程系 |
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| 摘 要： | 介绍硅片材料激光热处理技术，分析报道了激光热处理和实验结果；并把这一研究结果试用于晶体管生产线上。
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| 关 键 词： | 热光热处理，半导体器件，基片，PN结，热特性 |
| 收稿时间： | 1993/10/25 |
Experimental Study of Hot Curing of Si-wafers by Laser |
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| Cheng Guoyi,Cheng Nianpin,Kan Chengxia,Hu Zongfu.Experimental Study of Hot Curing of Si-wafers by Laser[J].Chinese Journal of Lasers,1994,21(8):688-692. |
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| Authors: | Cheng Guoyi Cheng Nianpin Kan Chengxia Hu Zongfu |
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| Abstract: | In this paper laser gettering technique is introduced.Its principle is analysed and some experimental results are presented. This technique is now on trial in a transistor'S production line. |
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| Keywords: | laser gettering semiconductor device's bsse P-N juction thermal property |
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