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Laser cutting of rectangular geometry into alumina tiles
Institution:1. High-Temperature Materials Unit, National Institute for Materials Science 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan;2. Argonne National Laboratory, 9700 South Cass Avenue Argonne, IL 60439, USA;3. Engineering Ceramic Team, Korea Institute of Ceramic Engineering and Technology, 3321 Gyeongchung Rd, Sindun-myeon, Icheon 17303, Republic of Korea
Abstract:Laser cutting of rectangular geometry into the 5 mm thick alumina tiles is carried out. Temperature and stress fields, which are developed during the cutting process, are simulated in line with the experimental conditions. The morphological changes in the cutting sections are examined using optical and electron scanning microscopes, energy dispersive spectroscopy, and X-ray diffraction technique. The predictions of surface temperature and the residual stress are validated through the experimental data. It is found that von Mises stress attains high values in the region of the mid-thickness of the workpiece. The laser cut sections are free from major cracks and large scale sideways burning. The predictions of surface temperature and residual stress agree well with their counterparts obtained from the experiment.
Keywords:Laser cutting  Alumina tiles  Temperature  Stress field
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