| 微传感器制造中的硅-玻璃静电键合技术 |
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| 引用本文： | 姚雅红,吕苗,赵彦军,崔战东.微传感器制造中的硅-玻璃静电键合技术[J].半导体技术,1999,24(4):19-23. |
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| 作者姓名： | 姚雅红 吕苗 赵彦军 崔战东 |
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| 作者单位： | 1. 清华大学精仪系导航与控制教研室,北京100084
2. 河北半导体研究所,石家庄050002 |
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| 摘 要： | 介绍了硅－玻璃静电键合的基本原理，阐述了在自建静电键合设备上实现静电键合的过程，结合其在微机械传感器中的应用，讨论了粗糙表面键合技术。
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| 关 键 词： | 微机械加工 硅-玻璃加工 静电键合 |
| 修稿时间： | 1998-09-09 |
Electrostatic Bonding of Silicon-Glass for Micromechanical Sensors |
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| Yao Yahong,Lu Miao,Zhao Yanjun,Cui Zhandong.Electrostatic Bonding of Silicon-Glass for Micromechanical Sensors[J].Semiconductor Technology,1999,24(4):19-23. |
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| Authors: | Yao Yahong Lu Miao Zhao Yanjun Cui Zhandong |
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| Abstract: | The theory of siliconglass electrostatic bonding is firstly introduced.Then a selfestablished setup is described and its features are specified.The bonding mechanism in the setup is studied in detail.Finally,the process conditions of rough surfaces are discussed in terms of application in fabricating micromechanical sensors and satisfied bonding results are achieved. |
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| Keywords: | MicromachiningSiliconglass fabricationElectrostatic bonding |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
