Selective metallization of polyimide by laser-induced plasma-assisted ablation (LIPAA) |
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| Authors: | Y Hanada K Sugioka H Takase H Takai I Miyamoto K Midorikawa |
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| Institution: | (1) RIKEN (The Institute of Physical and Chemical Research), 2-1 Hirosawa, Wako, Saitama 351-0198, Japan;(2) Department of Applied Electronics, Faculty of Industrial Science & Technology, Tokyo University of Science, 2641 Yamazaki, Noda, Chiba 278-8510, Japan;(3) Department of Electrical Engineering, Tokyo Denki University, 2-2 Nishiki-cho, Kanda, Chiyoda-ku, Tokyo 101-8457, Japan |
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| Abstract: | We report micromachining of polyimide (PI) by laser-induced plasma-assisted ablation (LIPAA) using a fundamental wavelength of a commercial Q-switched Nd :YAG laser (1064 nm). It is found that an Au film on a glass target is effective for the LIPAA process of PI. The ablation rate reaches several tens of nanometers per pulse. After the LIPAA process, selective metallization of PI with excellent electrical properties is performed by successive electroless Cu plating. The Cu line width of 40  m, which agrees with the line width of regions ablated by the LIPAA process, is achieved using an encapsulated film. PACS 42.62.-b; 52.38.-r; 85.40.Ls |
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