| CMOS影像感应器构装——湿式无电镀镍沉积技术之最佳化 |
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| 引用本文： | 许明哲,余智林,詹印丰,颜锡鸿,黄子馨. CMOS影像感应器构装——湿式无电镀镍沉积技术之最佳化[J]. 电子工业专用设备, 2009, 38(12): 1-6,19 |
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| 作者姓名： | 许明哲 余智林 詹印丰 颜锡鸿 黄子馨 |
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| 作者单位： | 弘塑科技公司,台湾新竹;弘塑科技公司,台湾新竹;弘塑科技公司,台湾新竹;弘塑科技公司,台湾新竹;弘塑科技公司,台湾新竹 |
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| 摘 要： | 无电镀镍金（Electroless Nickel ＆ Immersion Gold;简称ENIG）沉积可以选择性地沉积于铝垫,由于此技术不必使用高成本之光阻微影制程,也不需真空溅镀制程,它可以降低制造成本。然而在实际制造大量生产时,常常面临到化学镀液很难控制之问题。经由精密控制其化学镀液中之一些重要参数,例如温度、pH值、还原剂、镍及稳定剂浓度等,可以明显提高制程性能,以满足量产需求。
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| 关 键 词： | 无电镀镍金 锡铅凸块 附着层 扩散阻障层 湿润层 焊锡印刷 凸块底下金属层 二次锌活化处理 |
Electroless Nickel Plating Technology for CMOS Image Sensor Packaging |
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| XU Mingzhe,YU Zhilin,ZHAN Yinfeng,YAN Xihong,HUANG Zixin. Electroless Nickel Plating Technology for CMOS Image Sensor Packaging[J]. Equipment for Electronic Products Marufacturing, 2009, 38(12): 1-6,19 |
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| Authors: | XU Mingzhe YU Zhilin ZHAN Yinfeng YAN Xihong HUANG Zixin |
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| Affiliation: | XU Mingzhe,YU Zhilin,ZHAN Yinfeng,YAN Xihong,HUANG Zixin (Gr, Plastic Technology Corporation,Taiwan Xinzhu,China) |
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| Abstract: | Nickel plating and immersion Gold is a maskless wet chemical process that selectively deposits on aluminum pads. It eliminates the needs for equipment and materials for photolithography and sputtering,which reduces the production cost. However,even with the advantages of the electroless nickel process,manufactures have hesitated to implement the process due to the difficulties in controlling solution parameters for mass production. In the present study,the distinguished performance of electroless nickel can... |
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| Keywords: | Electroless Nickel & Immersion Gold ENIG Solder Bump Adhesive Layer Diffusion Barrier Layer Wetting Layer Solder Printing Under Bump metallurgy UBM Double Zincation Treatment |
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