晶圆级封装非制冷大面阵红外探测器应用分析

红外成像系统已经应用到军事和民用领域多年,但一直没得到广泛应用,主要原因是其分辨率低、成本高、工艺不稳定和技术门槛高等。解决这些问题需要从传感器工艺、探测器封装、红外图像处理芯片等方面加以改进。红外技术未来会朝低成本、专用处理芯片、高分辨率等方向发展。目前,国内厂商陆续推出了晶圆级封装(Wafer-Level Package,WLP)、高分辨率探测器和专用图像处理芯片等方面的新产品。但采用这些新器件的红外成像系统却没有得到相应的研究。本文主要基于烟台艾睿光电科技有限公司新推出的晶圆级封装的1280×1024元红外探测器以及专用图像处理芯片的实际应用,在系统架构、结构散热、成像算法等方面对由新器件构建的红外成像系统进行了验证分析。

Application Analysis of Wafer-Level Packaged and Large-Format Uncooled Infrared Detector

Infrared imaging systems have been used in the military and civilian fields for many years,but have not been widely used,mainly due to their low resolution,high cost,unstable process and high technical threshold.Solving these problems requires improvements in sensor technology,detector packaging and infrared image processing chips.Infrared technology will develop in the future in the direction of low cost,dedicated processing chips and high resolution.At present,domestic manufacturers have successively launched new products such as wafer-level packaging,high-resolution detectors and dedicated image processing chips.However,there is no corresponding research on the infrared imaging system of these new devices.This article is mainly based on the practical application of Yantai IRay Technology Co.,Ltd.′s new wafer-level packaged 1280×1024 infrared detector and the special image processing chip.The infrared imaging system is verified and analyzed in terms of system architecture,structural cooling and imaging algorithms.