FT中的OS失效及应对措施

科学技术的进步促使集成电路产业迅猛发展，“摩尔定律”还在继续着它的预言，集成电路变得日益“娇小”，但单块硅芯片上所集成的晶体管数目却数量惊人，实现的功能更为强大，如何判断功能复杂的芯片是否实现预期的效果成为IC产业中非常重要的步骤。作为集成电路产业链中重要的一环：测试也是机遇和风险并存。Final Test是集成电路投入市场前的重要环节，测试结果的真实性、可靠性将直接影响到供应商的销售利润及公司声誉。文章抛开那些复杂的测试项目，分析了Final Test中常见的0S（Open／Short）失效案例及其应对措施。

Open Short Fail in Final Test and Solution

The technology of science＇s progress urges the integrated circuit industry swift and violent development, ＂Moore＇s Law＂ also in continues its prediction, the integrated circuit is becoming day by day small, but on the monolith silicon chip integrates transistor number quantity is actually astonishing, the realization function is more formidable, how judges the function complex chip whether realizes the anticipated effect？ As integrated circuit industry chain in an important link： The IC test also is the opportunity and risk coexisting. Final Test Will be the important link before the integrated circuit invests in front of the market, the truth and the reliability of test result directly affects supplier＇s sales profit and the company prestige. This article abandons these complex test project, and should mention from the common OS fail case and the measure about it.