(1) Agladze Institute of Inorganic Chemistry and Electrochemistry, Academy of Sciences of Georgia, Tbilisi, Georgia
Abstract:
Dependences of the copper etching rate in a water-monoethanolamine medium on the solution pH and concentration of Cu(II) in the presence and absence of chloride ions are determined. An increase in the stability of univalent species and in the diffusion coefficient of Cu(I) at pH 10.30 is attributed to chelation. The mechanism of copper etching in the medium is proposed. The copper etching deceleration at pH > 10.30 is attributed to the metal blockage by surface compounds.
