Error analysis and thermal expansion measurement with electron-beam moiré

In this paper, the authors study erros incurred when using the experimental technique of electron-beam moiré. There are two sources of error: error manifested as an apparent magnificant drift and error due to fringe tracing. The error due to fringe tracing is nearly negligible in comparison to the error due to magnification drift. By investigating the thermal expansion of commercially pure copper, the authors demonstrate the usefulness of the error estimate. The average result for the coefficient of thermal expansion is within 1.8 percent of handbook values for this materials, with a possible error due to apparent magnification drift of 9 percent.