Influence of temperature on tensile and fatigue behavior of nanoscale copper using molecular dynamics simulation |
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| Institution: | 1. Department of Mechanical Engineering, Kun-Shan University of Technology, 949 Tawan Roaad, Yung-Kong, Tainan 71016, Taiwan;2. Department of Mechanical Engineering, Southern Taiwan University of Technology, Tainan, Taiwan;1. Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People’s Republic of China;2. Center for Advanced Mechanics and Materials, Tsinghua University, Beijing 100084, People’s Republic of China;3. CNMM, Tsinghua University, Beijing 100084, People’s Republic of China;1. Department of Engineering Mechanics, State Key Laboratory of Ocean Engineering, School of Naval Architecture, Ocean and Civil Engineering, Shanghai, PR China;2. R&D Center, AECC Commercial Aircraft Engine Co. LTD, Shanghai, PR China;1. Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;2. Department of Physics, University of Illinois at Urbana Champaign, Urbana, IL 61801, USA;3. Department of Materials Science and Engineering, University of Tennessee, Knoxville, TN 37996-2100, USA |
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| Abstract: | The tensile and fatigue behavior of nanoscale copper at various temperatures has been analyzed using molecular dynamics simulation. The stress–strain curve for nanoscale copper was obtained first and then the Young's modulus of the material was determined. The modulus was larger than that obtained by previous studies and decreased with increasing temperature. From the fatigue test, the cyclic stress–number of cycles curve was obtained and the stress increased with increasing temperature. Furthermore, the ductile fracture configuration was observed in the fatigue testing process under the lower applied stress. It was also observed that nanoscale copper appears to have a fatigue limit of 105 cycles. |
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