| 千差万别 异曲同工——谈RFID电子标签的封装形式和封装工艺 |
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| 引用本文： | 朱铭广.千差万别 异曲同工——谈RFID电子标签的封装形式和封装工艺[J].中国电子商情,2006(1). |
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| 作者姓名： | 朱铭广 |
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| 作者单位： | 上海申博智能标识技术有限公司 |
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| 摘 要： | 由RFID成功案例中归纳出的电子标签三大封装形式可以看出,封装形式取决于实际应用的需求,而封装工艺则根据设计形式而不同,另外正确选择封装工艺还能保证产品质量。
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| 关 键 词： | RFID 应用 封装 嵌体 传输 |
Talking about RFID Tag's Package Type and Packaging Process |
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| Shanghai Shenbo Intelligent Identification Technology Co.Ltd Zhu Mingguang.Talking about RFID Tag's Package Type and Packaging Process[J].China Electronic Components & Devices Market:A & V Fornt-line,2006(1). |
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| Authors: | Shanghai Shenbo Intelligent Identification Technology CoLtd Zhu Mingguang |
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| Institution: | Shanghai Shenbo Intelligent Identification Technology Co.Ltd Zhu Mingguang |
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| Abstract: | This article points out that what kind of package is used depends on the actual requirement, and that packaging process depends on design after inducing three seal types of tags from the previous successful RFID cases. Otherwise, seal process which is properly selected could guarantee the product quality. |
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| Keywords: | RFID Application Package Inlay Transfer |
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