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A new TiW seed layer for SmCo5 films with perpendicular magnetic anisotropy |
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| Authors: | Weiming Cheng Wenwu Liu Xiao Wang Yifan Dai Xiaomin Cheng Xiangshui Miao |
| Institution: | 1. Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China;2. Department of Electronic Science and Technology, Huazhong University of Science and Technology, Wuhan 430074, China;3. Wuhan National High Magnetic Field Center, Huazhong University of Science and Technology, Wuhan 430074, China |
| Abstract: | A new seed layer TiW is proposed for SmCo5 films with perpendicular magnetic anisotropy. The influence of a TiW seed layer on the microstructure and the surface morphology of Cu underlayer are studied. The grain size and surface roughness dependence of Cu underlayer on the thickness and the annealing of the TiW seed layer are also investigated. The improvement in the perpendicular magnetic properties of SmCo5 film from the TiW seed layer is approved. The results show that a 5 nm Ti3W7 seed layer improves the microstructure and surface morphology of Cu underlayer, and significantly improves the perpendicular magnetic properties of SmCo5 film. The diffusion barrier and a high melting point of the TiW seed layer are regarded as the physical mechanism of the improvement for SmCo5 film with perpendicular magnetic anisotropy. |
| Keywords: | Non-ferrous metal and alloy Magnetic Microstructure |
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