Thermal properties of polyimide system containing silicone segments

The influence of the structure properties relationships of silicone incorporated polyimide (PI) on thermal stability was investigated by using single scan thermogravimetric analysis (TG) and differential scanning calorimetry (DSC) in nitrogen. Four systems have been synthesized based on monomer 4-(4-(1-(4-(4-aminophenoxy) phenyl)-1-methylethyl) phenoxy) aniline (BAPP)/3,3??,4,4??-Biphenyltetracarboxylic dianhydride including parent PI (S-1), PI siloxane copolymer (S-2 and S-3), and PI siloxane hybrid (S-4). The derivative thermogravimetric analysis (DTG) and DSC curves indicate a double and single stage decomposition process and glass transition temperature (T _g), respectively. While the PI, PIS, and PSH showed distinctive features towards thermal analysis, it was found that the rate of degradation (???/??t) was influenced by the flexibility of Si?CO?CSi in the backbone and in Si?CO?CSi itself. These results revealed that the presence of Si?CO?CSi in either the backbone or matrix indicates its stability with regard to high thermal service applications.