Electrooptic sensor module fabrication for near-field intrabody communication

In this paper, we describe how to obtain a low cost electrooptic (EO) sensor module for the mass production of near-field intrabody communication devices. In our previous study, we used a bulk cleavage technique to fabricate EO modulators without the need for any optical polishing or washing processes. In this study, we fabricated EO modulators as a miniaturized chip sensor without a base portion, and clarified the feasibility of assembling optical components by only a passive alignment technique with a compact housing.