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Electro-elastostatic analysis of multiple cracks in an infinitely long piezoelectric strip: A hypersingular integral approach
Authors:L Athanasius  WT Ang  I Sridhar
Institution:1. Ecole Polytechnique Fédérale de Lausanne (EPFL), Institute of Microengineering (IMT), Photovoltaics and Thin-Film Electronics Laboratory, 2000 Neuchâtel, Switzerland;2. Institute for Microstructure Research, Ernst Ruska-Centre for Microscopy and Spectroscopy with Electrons Peter Gruenberg, Institute Research Centre Juelich, D-52425 Juelich, Germany;1. School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore;2. School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore;1. School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore;2. Rolls-Royce @NTU Corporate Laboratory, Nanyang Technological University, Singapore 639798, Singapore;1. Department of Materials Science and Engineering, University of North Texas, Denton, TX 76201, USA;2. School of Materials Science and Engineering, Nanyang Technological University, 639798 Singapore, Singapore;3. Department of Mechanical Engineering, Cleveland State University, Cleveland, OH 44115, USA
Abstract:The problem of an arbitrary number of arbitrarily oriented straight cracks in an infinitely long piezoelectric strip is considered here. The cracks are acted by suitably prescribed internal tractions and are assumed to be either electrically impermeable or permeable. A Green's function which satisfies the conditions on the parallel edges of the strip is derived using a Fourier transform technique and applied to formulate the electroelastic crack problem in terms of a system of hypersingular integral equations. Once the hypersingular integral equations are solved, quantities of practical interest, such as the crack tip stress and electric displacement intensity factors, can be easily computed. Some specific cases of the problem are examined.
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