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Deformation characteristics of nanocrystalline copper and nickel at low temperatures
Authors:V. V. Shpeizman  V. I. Nikolaev  B. I. Smirnov  V. V. Vetrov  S. A. Pul’nev  V. I. Kopylov
Affiliation:(1) A. F. Ioffe Physicotechnical Institute, Russian Academy of Sciences, 194021 St. Petersburg, Russia;(2) Physicotechnical Institute, Academy of Sciences of Belarus, 220730 Minsk, Belarus
Abstract:Measurements were made of the deformation and fracture characteristics of nanocrystalline copper and nickel at temperatures between 4.2 and 300 K. It was observed that the flow stresses are sensitive to the sign of the load while deformation instability was observed at temperatures close to liquid-helium temperature. The temperature dependence of the yield stress was obtained. It was found that there is a range of a thermal deformation at low temperatures which extends to 60 K for nickel and 200 K for copper. Possible reasons for these characteristics in the deformation behavior of nanocrystalline materials are discussed, especially the role of quantum effects in the low-temperature deformation. Fiz. Tverd. Tela (St. Petersburg) 40, 1264–1267 (July 1998)
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