Controlled gold doping of silicon by using ion implantation

A new technology is suggested to dope silicon devices with gold for carrier life time adjustment with high accuracy and reproducibility. Ion implantation is used to dope the sample with a well defined total amount of gold. This gold dose is redistributed by high temperature anneal. A computer simulation of gold diffusion and experimental radio tracer results show that highly accurate gold doping can be obtained in bulk material when temperatures around 1000 C are applied during the redistribution anneal. Damage free surfaces must be used to reduce the gold content gettered in surfaces.