Adhesion of polyimide films to microelectronic article components |
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| Authors: | S. F. Sen’ko Yu. P. Snitovskii |
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| Affiliation: | (1) Physicotechnical Institute, National Academy of Sciences of Belarus, State Scientific Establishment, Minsk, Belarus;(2) Educational Establishment, Belarus State University of Informatics and Radioelectronics, Minsk, Belarus |
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| Abstract: | Reactions between polypyromellitamido acid and component materials of microelectronic articles were examined by thermogravimetric analysis. Modes of modification of the surfaces of semiconductor structures to be used in formation of a system of interconnections with polyimide as interlayer insulator to obtain a high adhesion between the layers via their chemical reactions. |
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