In-situ tensile testing of nano-scale specimens in SEM and TEM |
| |
Authors: | M A Haque M T A Saif |
| |
Institution: | (1) Department of Mechanical & Industrial Engineering, University of Illinois at Urbana-Champaign, Urbana-Champaign, USA |
| |
Abstract: | We present a new experimental method for the mechanical characterization of freestanding thin films with thickness on the
order of nanometers to micrometers. The method allows, for the first time, in-situ SEM and TEM observation of materials response
under uniaxial tension, with measurements of both stresses and strains under a wide variety of environmental conditions such
as temperature and humidity. The materials that can be tested include metals, dielectrics, and multi-layer composites that
can be deposited/grown on a silicon substrate. The method involves lithography and bulk micromachining techniques to pattern
the specimen of desired geometry, release the specimen from the substrate, and co-fabricate a force sensor with the specimen.
Co-fabrication provides perfect alignment and gripping. The tensile testing fits an existing TEM straining stage, and a SEM
stage. We demonstrate the proposed methodology by fabricating a 200 nm thick, 23.5 μm wide, and 185 μm long freestanding sputter
deposited aluminum specimen. The testing was done in-situ inside an environmental SEM chamber. The stress-strain diagram of
the specimen shows a linear elastic regime up to the yield stress σ
y
MPa, with an elastic modulusE=74.6 GPa. |
| |
Keywords: | Mechanical properties MEMS fabrication tensile testing thin films |
本文献已被 SpringerLink 等数据库收录! |
|