| 倒芯片互连用的高密度积层封装基板——DSOL技术 |
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| 引用本文： | 蔡积庆. 倒芯片互连用的高密度积层封装基板——DSOL技术[J]. 印制电路信息, 2003, 542(7): 51-53,65 |
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| 作者姓名： | 蔡积庆 |
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| 作者单位： | 南京无线电八厂 |
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| 摘 要： | 概述了NEC开发的新型高密度封装用积层基板技术:DSOL,它以高解像度的勿系树脂为绝缘层,形成高膜厚/孔径比的微细导通孔,采用溅射薄膜和半家成镀工艺形成微细铜导体,适用于多针数区域阵列倒芯片封装用基板。
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| 关 键 词： | DSOL技术 芴系树脂 倒芯片 积层封装基板 溅射膜 |
High-density Build-up Packaging Substrate for Flip-chip Interconnections--DSOL Technology |
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| Cai Jiqing. High-density Build-up Packaging Substrate for Flip-chip Interconnections--DSOL Technology[J]. Printed Circuit Information, 2003, 542(7): 51-53,65 |
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| Authors: | Cai Jiqing |
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| Abstract: | This paper describes the new high-density build-up packaging substrate technology:DSOL (Deposited Substrate on laminecte) developed by NEC,which has advantages of very fine and high-aspect-ratio via holes based on a high-resolution fluorene based resin dielectric,and very fine pitch Cu conductors using sputtering film and the semi-additive plowting process.lt is suitable for very high-density packaging substrate for high-pin-count area array flip-chip intercounections. |
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| Keywords: | DSOL technology fluorene based resin build-up packaging substrate for flip-chip interconnection sputtering film |
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